- ANTOM
- Multi Reflow
- Canon
- BESTEM-D531t
- BESTEM-D510/C310
- 3D Inspection
- HANWA
- W5100D
- N5000
- OKK
- Wafer expander
- Dicing frame cleaning
machine - Spin dryer
- Wafer Vaccume
mounter - OTHER PARTS
- NTT-AT
- Furukawa battery
- Consumer Parts
Machinery List
Multi Reflow
- All heating zone is available up to
350 degree - N2 machine achieved oxygen concentration 200ppm (option/100ppm)
Name | UNI-6116S | |
---|---|---|
Power Requirement | 3ø 200V 18kVA (18kW) | |
Machine Weight | About 500kg | |
N2 Supply | More than 250L/minutes | |
0.4Mpa Purity more than 99.99% | ||
Valid width of Board | Pin chain | 50 to 160mm |
Mesh | Max. 160mm | |
Conveyer type | Pin chain system*1 | |
Conveyer speed | 0.1 to 0.5m/minutes | |
Conveyer hight | 900±20mm | |
Max board hight | Refer to structure spec chart | |
Number of heater panel | ||
Circulation fan |
Option
Name | UNI-6116S |
---|---|
Over heating protection | |
Mesh Conveyor *2 | |
Conveyor automatic width adjustment | |
Anti warping system | |
Anti warping automatic position adjustment | |
Circulation fan stop detection | |
N2 specification |
Name | UNI-6116S |
---|---|
Oximeter | |
Oxygen concentration controller | |
100ppm optional | |
Flux removal system | |
UPS | |
Color order |
12-inch High performance
Die Bonder for system in package
BESTEM-D531t will enable you
to bond ultra precision bonding of NAND FLASH
-
Thin Die Capability
2 motion needleless pick up system, up to 15μm
-
Highest Accuracy Bonding Capability
Achieves die-bonding accuracy of ±8μm, θ=±0.05° (3σ)
-
Flexible Handling
Able to handle the lead frame size of 1.0~25.0mm, and the substrate size of Length 100~300mm
Clip Bonding Line
High Performace Clip
bonding System
Face-up / Face-down
bonding flexible integration
-
Best TCO
High UPH,Small Foot Print,Minimized Conversion Multi Dispense Head
-
Best Quality
High Accuracy thermal management
-
Flexible Handling
Clip Size:1.0mm~ / Flip Chip bonding:0.3mm~ / with high quality
Automated Wire Bonding
Inspection System
Automated Wire
Bonding Inspection System
Epoch Making 3D Visual inspection
Only one second of measurement time, easy operations and flexible inspections.
-
High Accuracy Measurement
Height:1μm,3σ
-
Measurement Ability
Speed:1.0sec / Max measurement angle:±55°
-
3D/2D Data Acquisition
Data generated at once scanning
- 35 years experience in LED/LSI industry for any size Wafer or PKG level worldwide.
- Reliable Japanese quality
- System with simple design, easy maintenance.
- JEITA/ESDA/JEDEC/AEC standard.
- Capable of testing HBM, MM and HMM.
W5100D
Specification
For pulse | |
---|---|
Zap Voltage | ±10~±40KV(Op.8KV) |
Step Voltage | ±5V |
Zap Accuracy | 1%±10V |
Test speed | 0.5s/1pin |
Interval time | 0.3~9.9s |
Zap count | 1-9999 |
X-Y movable range | 99mmx99mm |
Move Resolution | 1.25μm |
For measurement | |
---|---|
Measurement Voltage | 0~±40V (Op.±80V) |
Measurement current accuracy | 1.0%±(1/500F.S.±10nA) |
Measurement point | MAX 20 |
Measurement current | 0~±100mA |
Measurement Resolution | ±0.1V |
Measurement table | MAX 10 |
Measurement output | Table •Trace•CSV files |
For power/etc utility | |
---|---|
Power | 100/115V 20A MAX 50/60 Hz |
Control | RS232C |
Weight | 170Kg |
OSt | Windows |
Dimension | 150(W)x1300(D)x1000(H) (PC contained) |
- 35 years experience in LED/LSI industry for any size Wafer or PKG level worldwide.
- Reliable Japanese quality
- System with simple design, easy maintenance.
- JEITA/ESDA/JEDEC/AEC standard.
- Capable of testing HBM, MM and HMM.
N5000
Equipment model | HED-N5256-D2/6, HED-N 5512-D2/6, HED-N51024-D2/6 |
---|---|
Capacity of power modelsupplyVoltage | 256 pins and 512 pins - 100V/15A, 1024 pins - 100V/20A |
Pin number of max. measurement | 256 pins,,512 pins, 1024 pins |
Pulse voltage | MMx2, HBMX2 are featured as standards |
Pulse voltage step | ±5V |
Pulse zapping number | 1-99times |
Pulse interval | 0.3~9.9s |
Accuracy of charge voltage | 1%±10V |
Bias DC power supply | ±35V/1A |
Vsupply over-voltage power (for latch up test) | 100V(1V step) |
V f/lm measurement power supply | ±40V (0.1V step) / 100mA |
Accuracy of V f/lm measurement | 1±(1/500FS±10nA) |
Pulse current supply | ±1A (1mA step) |
Wave form sampling (for latch up test) | 10MHz, Max.4000 points |
Destruction judgement | Changing amount judgement/Absolute value judgement |
Outer dimensions | 1600(W)X900(D)X1500(H) |
Weight | 150kg~200kg |
Basic software(OS) | Windows |
Wafer expander
- Completely dry processing
- Setting of precise conditions is possible
- Supports fully automatic operation
- Automatic cutting function
Dimention | W700 ×D1250×H1470 |
---|---|
Weight | Approx.250kg |
Expand Stroke | 7mm ×50mm(±0.1mm) *stopping precision :±0.1mm/sec |
Vertical speed | 0.1mmー20mm/sec *adjusting rate :0.1mm/sec |
Temperature adjustment | room temperature to -80℃ |
Size | 8" dicing frame. |
Dicing frame
cleaning machine
- Double catching protection device
- Processing speed adjustable function
- One-touch operation available for scheduling change (including up to 12")
- Smooth handling between processes
Dimention | W2580 ×D1250×H1800 |
---|---|
Model | DFW-700 |
Dicing frame | 8inch , 12inch |
Cleaning method | Scrub cleaning by melamine sponge |
Drying method | Suction drying and Air blowing |
Performace | Max.300pcs/Cart(LD/ULD) |
Processing time | 12inch : Min 50sec. |
Spin dryer
- Strictly eliminates dust causing factor
- Unigue balancing technology make it better performance (patent)
- Equipped with the ionizer and ULPA filter.
Dimention | W1000 ×D1300×H1107 |
---|---|
Axis sealing | Forced vacuuming together with dust seal |
Dicing frame and water | 12inch/ I or 2 cradle |
Wafer Vaccume mounter
- Low-damage mounting to fragile wafers!
- Provide the full-automatilon systems(option)
Dimention | W500 ×D700×H945 |
---|---|
Weight | Approx.140kg |
Recipe settings | choose from 10 types |
Dicing frame | 2 to 8 inch * 12inch is negotiable. |
Tape suitable for processing | All kinds of tapes and adhesives |
Condensation
Prevention Sheet
NTT-AT
- POINT1Dew condensation problems are solved with Humidity Control Sheet!
- Long lasting and easy maintenance!
- Flexible design to fit any enclosures!
Production Name | Size (mm) | Weight (g) | Application Capacity (L) | Contents |
---|---|---|---|---|
GB-L | 560×230×3 | 130 | 400 | 5 |
GB-M | 370×150×3 | 50 | 150 | 10 |
GB-P | 100×148×1 | 10 | 25 | 30 |
GB-N | 55×91×1 | 3 | 7 | 30 |
Furukawa battery
- Higher Capacity
- Stronger to large current discharging
- Stronger to fast charging
- Longer life span even under poor charge state
Type | UB-1000 | |
---|---|---|
Nominal Voltage / V | 2 | |
Rated Capacity Ah[10hr-rate] at 25deg. C | 1,000 | |
Nominal Energy / Wh | 2,000 | |
Mass / kg (approx.) | 73 | |
Dimensions / approx. mm | Height | 508 |
Width | 172 | |
Depth | 303 | |
Mass energy density / Wh / kg | 27.4 | |
Volume energy density / kWh / m3 | 79.0 | |
Maximum current | Charge | 0.4CA |
Discharge | 0.6CA | |
Estimated cycle life at 25deg. C | Charge | 4,500 |
Discharge | 5,500 |
Consumer Parts
Dicing Ring